Printed Circuit Board Image Inspection Equipment "AURCA Series"
AI inspection and measurement solution for printed circuit boards, image inspection device "AURCA Series"
■Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - AI + conventional algorithm integrated detection (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■Examples of inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign object contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign objects, scratches, oxidation, corrosion, film cracks, bright spots
- Company：ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所
- Price：Other
